• 製程能力

    Item Capability
    Layer count 層數 Up to 20 layer 高達20層
    Min. Core Thickness 最小基板厚度 2 mil
    Min. Board Thickness 最小成品板厚 2L:10mil; 4L:14mil; 6L:18mil; 8 L:25mil
    Max Board Thickness 最大成品板厚 236mil
    Max Panel Size 最大工作尺寸 21” x 24” (533mm x 610mm)
    Materials 材料 FR4(標準) Isola/Nanya/ITEQ
    FR4(Hi-Tg) Isola/Nanya/ITEQ
    Rogers RO4003/4350/3010/RT Duroid 5880/5870
    Arlon Diclad 25N/25FR/870/880
    Taconic TLY/TLC/RF35&RF30
    Nelco N9000/ N4000-6/ N4000-13
    IMS(Insulated Metal Substitute) 金屬基板 FR4+AL/Berquist+AL/Rogers+AL or Copper
    Drilling 鑽孔 Min. Drilled Hole Size 最小鑽孔孔徑 10mil
    Annular Ring 孔環 115μm(normal); 100μm(for Laser)
    Registration 對準度 ±3~5mil
    Min. Finished Hole Size 最小成品孔徑 8mil
    Copper Weight 銅厚 1/3 oz, 1/2 oz, 1~5 oz
    Conductor Tolerance for Trace Width 導體線寬公差 ±20%
    Surface Conductor Thickness 面銅厚度 >51μm (for 1oz.); >82μm (for 2oz.)
    Min. Hole Surface Copper 最小孔銅厚度 >0.8mil, Ave. 1mil
    Max. Aspect Ratio 最大縱橫比 8:1
    Image Transfer
    圖像轉移    		 Min. Track and Gap 最小線寬/線距 4/4mil
    SMT/BGA. Pitch 10mils for SMT; 32mils for BGA
    Track and gap 線寬/線距 3mil
    Solder Mask 防焊

    		 Photo imager(LPI)Solder Mask
    液態感光防焊油墨    		 Green, Yellow, Blue, Red, Black
    綠,黃,藍,紅,黑
    Via Plugging (min. 80%)
    防焊塞孔 (min. 80%)    		 Yes
    Peelable Solder Mask 可剝離防焊 Yes
    Registration 對準度 ±2mil
    Solder Dam Width 隔焊寬度 ±3mil
    Thickness Over Trace 防焊厚度 0.2~1.5mil
    Silkscreen 文印 White, Yellow, Black 白,黃,黑
    Min. legend width 最小文字寬度 8mil
    Tolerance of CNC Dimension 成型尺寸公差 +/-4mil
    Tolerance of Punch Dimension 沖壓尺寸公差 +/-4mil
    Blind Vias / Buried Vias 盲孔/ 埋孔 Yes
    POV(Pad on Vias) POV設計 Yes
    Impedance control 阻抗控制 ±10%
    Surface Finishing
    表面處理    		 Pb free HASL 無鉛噴錫 100u”
    HASL(non lead-free) 有鉛噴錫 40~120 u”
    Immersion Gold 化學鎳金 1~5 u”
    Immersion Silver 化學銀 8~12 u”
    Immersion Tin 化學錫 25~40 u”
    Hard Gold & Gold Finger 硬金 & 金手指 Yes
    Gold Finger Plating 金手指電鍍金 5,8,10,15,20,30 u”
    OSP (OSP) 有機保焊膜 0.25~0.35 u”
    Carbon Ink 碳墨 20Ω
    Peelable Ink 可剝離油墨/可剝膠 t=0.3m/m
    Laser Drill & Horizontal Plating 雷射鑽孔 & 水平電鍍 Sub-contactor 委外

返回